Equipment Scale
Manufacturing Capacity
| Project | Capability |
PCB board size | 550mmX1200mm |
PCB thickness | 8mm |
SMT part size | 01005-74X74mm |
IC Pitch | 0.3mm |
BGA/CSP | 0.35mm |
PCBA complexity | Double-sided patch, dispensing, plug-in, crimping, heat sink |
Nitrogen reflow/gas phase soldering | Yes |
Wave soldering/selective wave soldering | Lead-free（ERSA） |
Craft | Lead-free |
BGA inspection | 3D，5DS |
BGA rework | Yes (ERSA BGA rework station, maximum BGA 70X70mm) |
Three anti-paint | Yes |
ICT | Yes (software and hardware design, development) |
FCT | Yes (software and hardware design, development) |
Assembly | Yes |
package | Yes |
HASA | Yes (-100-200 degree cycle) |
Ageing | Yes (50土5) |
Scoreboard | Laser sub-board, mechanical sub-board |
Quality Assurance
Operating standard: IPC-A-610E inspection level II (according to customer requirements)
Accept the quality level AQL: Fatal defect: 0 / Important defect: 0.4 / Minor defect: 1.0
Quality system standards: ISO 9001:2008/ISO 14001/ISO 13485 (2016)/IATF 16949/AS9001D
